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| ![P0200-20 P0200-20](https://oss.origin-ic.net/productImages/MFG_P0200-20.jpg) | COMPOUND HEAT SINK 2OZ JAR | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 12 Months | - | P0200 | Non-Silicone Compound | - | - | 100 gram Jar |
| ![P0200-19 P0200-19](https://oss.origin-ic.net/productFiles/image/product/thermal-adhesives-epoxies-greases-pastes/P0200-19.jpg) | HEAT SINK COMP. SARAN PKG 2GR | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 12 Months | - | P0200 | Non-Silicone Compound | - | - | 2 gram Package |