选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Series | Shelf Life | Shelf Life Start | Mesh Type | Diameter | Type | Composition | Melting Point | Flux Type | Wire Gauge | Process | Form | Storage/Refrigeration Temperature |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | 0.118" (3.00mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | - | 9 AWG, 11 SWG | Lead Free | Spool, 11.02 lbs (5kg) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 12 Months | Date of Manufacture | 3 | - | Solder Paste | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | - | Leaded | Syringe, 0.53 oz (15g), 5cc | 37°F ~ 46°F (3°C ~ 8°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 282 | - | - | - | 0.031" (0.79mm) | Wire Solder | Sn63Pb37 (63/37) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | 0.059" (1.50mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Spool, 1 lb (453.59g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | CHIPQUIK® | - | - | - | 0.015" (0.38mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | Spool, 1 lb (453.592g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 268 | 36 Months | Date of Manufacture | - | 0.025" (0.64mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | Spool, 17.64 oz (500g) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 285 | - | - | - | 0.015" (0.38mm) | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | - | - | - | 0.015" (0.38mm) | Wire Solder | Sn60Pb40 (60/40) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | Spool, 8.8 oz (250g) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 296 | - | - | - | 0.010" (0.25mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | Lead Free | Spool, 3.53 oz (100g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Solid Solder Wire | - | - | - | 0.118" (3.00mm) | Wire Solder | Sn97Ag3 (97/3) | 430 ~ 435°F (221 ~ 224°C) | - | 9 AWG, 11 SWG | Lead Free | Spool, 5.51 lbs (2.5kg) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 296 | - | - | - | 0.031" (0.79mm) | Wire Solder | Sn63Pb37 (63/37) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Solid Solder Wire | - | - | - | 0.118" (3.00mm) | Wire Solder | Sn63Pb37 (63/37) | 361°F (183°C) | - | 9 AWG, 11 SWG | Leaded | Spool, 11.02 lbs (5kg) | 50°F ~ 104°F (10°C ~ 40°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | WP601-ZH | 6 Months | Date of Manufacture | - | - | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | Cartridge, 21.16 oz (600g) | 32°F ~ 50°F (0°C ~ 10°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | SMD2 | - | - | - | 0.031" (0.79mm) | Wire Solder | Sn60Pb40 (60/40) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Weller® | - | - | - | 0.012" (0.31mm) | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | No-Clean | - | Lead Free | Spool, 3.53 oz (100g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | 0.020" (0.51mm) | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | Leaded | Spool, 1 lb (454 g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Smooth Flow™ | 6 Months | Date of Manufacture | 5 | - | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Jar, 1.76 oz (50g) | 37°F ~ 46°F (3°C ~ 8°C) | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Super Low Dross™ | - | - | - | - | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | Bar, 0.5 lb (227g) | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | SMD2 | 24 Months | Date of Manufacture | - | 0.030" (0.76mm) | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | Jar | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | - | - | - | 0.031" (0.79mm) | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 430°F (221°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | Spool, 1 lb (454 g) | 50°F ~ 104°F (10°C ~ 40°C) |
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