片上系统 (SoC)

结果:
4,611
Manufacturer
Series
Supplier Device Package
Package / Case
Primary Attributes
Speed
Connectivity
Core Processor
Peripherals
RAM Size
Operating Temperature
Architecture
Flash Size
Type
Function
Voltage - Supply
Utilized IC / Part
Embedded
Grade
Mounting Type
Qualification
Serial Interfaces
Data Interface
Voltage Supply Source
Power - Output
Number of Channels
Supplied Contents
Current - Receiving
Modulation
Data Rate (Max)
Protocol
Number of Logic Elements/Cells
Resolution (Bits)
Sampling Rate (Per Second)
Current - Transmitting
Total RAM Bits
Number of LABs/CLBs
Number of I/O
RF Family/Standard
GPIO
Sensitivity
Memory Size
Number of Gates
Frequency
结果4,611
选择
图片产品详情单价可用性ECAD 模型Operating TemperatureGradePackage / CaseSupplier Device PackageFlash SizeRAM SizePeripheralsSeriesArchitectureCore ProcessorConnectivitySpeedPrimary AttributesQualification
XCZU2CG-1SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$84.5070
10+
$78.8732
15+
$76.0563
数量
2,383 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
10AS032E3F29I2SG
IC SOC CORTEX-A9 1.5GHZ 780FBGA
5+
$1161.9718
10+
$1084.5070
15+
$1045.7746
数量
2,250 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
780-BBGA, FCBGA
780-FBGA, FC (29x29)
-
256KB
DMA, POR, WDT
Arria 10 SX
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 320K Logic Elements
-
XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$116.1972
10+
$108.4507
15+
$104.5775
数量
2,200 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 275K Logic Cells
-
XCZU2CG-2SFVC784I
IC SOC CORTEX-A53 784FCBGA
5+
$802.8169
10+
$749.2958
15+
$722.5352
数量
2,115 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XCZU9EG-2FFVB1156I
IC SOC CORTEX-A53 1156FCBGA
5+
$591.5493
10+
$552.1127
15+
$532.3944
数量
2,082 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
1156-BBGA, FCBGA
1156-FCBGA (35x35)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EG
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 600MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
-
M2S010-FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
5+
$80.2817
10+
$74.9296
15+
$72.2535
数量
2,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-BGA
484-FPBGA (23x23)
256KB
64KB
DDR, PCIe, SERDES
SmartFusion®2
MCU, FPGA
ARM® Cortex®-M3
CANbus, Ethernet, I²C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
-
XCZU2CG-1SBVA484I
IC SOC CORTEX-A53 484FCBGA
5+
$528.1690
10+
$492.9577
15+
$475.3521
数量
2,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
484-BFBGA, FCBGA
484-FCBGA (19x19)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
XC7Z020-3CLG484E
IC SOC CORTEX-A9 866MHZ 484BGA
5+
$19.6479
10+
$18.3380
15+
$17.6831
数量
2,000 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
866MHz
Artix™-7 FPGA, 85K Logic Cells
-
5CSEBA4U23I7N
IC SOC CORTEX-A9 800MHZ 672UBGA
5+
$48.5915
10+
$45.3521
15+
$43.7324
数量
1,930 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
672-FBGA
672-UBGA (23x23)
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 40K Logic Elements
-
XC7Z007S-1CLG225I
IC SOC CORTEX-A9 667MHZ 225BGA
5+
$21.1268
10+
$19.7183
15+
$19.0141
数量
1,920 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
225-LFBGA, CSPBGA
225-CSPBGA (13x13)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Single ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix™-7 FPGA, 23K Logic Cells
-
XC7Z100-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$147.8873
10+
$138.0282
15+
$133.0986
数量
1,872 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 444K Logic Cells
-
XA7Z020-1CLG400I
IC SOC CORTEX-A9 667MHZ 400BGA
5+
$26.4085
10+
$24.6479
15+
$23.7676
数量
1,854 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
Automotive
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
-
256KB
DMA
Zynq®-7000 XA
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix™-7 FPGA, 85K Logic Cells
AEC-Q100
5CSEBA2U19C8N
IC SOC CORTEX-A9 600MHZ 484UBGA
5+
$507.0423
10+
$473.2394
15+
$456.3380
数量
1,836 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
484-FBGA
484-UBGA (19x19)
-
64KB
DMA, POR, WDT
Cyclone® V SE
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 25K Logic Elements
-
XC7Z030-1FFG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
5+
$69.7183
10+
$65.0704
15+
$62.7465
数量
1,820 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
676-BBGA, FCBGA
676-FCBGA (27x27)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Kintex™-7 FPGA, 125K Logic Cells
-
XCZU3CG-1SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$950.7042
10+
$887.3239
15+
$855.6338
数量
1,766 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
-
XCZU4CG-L1FBVB900I
IC SOC CORTEX-A53 900FCBGA
5+
$211.2676
10+
$197.1831
15+
$190.1408
数量
1,735 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
-
XAZU5EV-1SFVC784Q
IC FPGA SOC ZU EV Q100 784SBGA
5+
$143.6620
10+
$134.0845
15+
$129.2958
数量
1,695 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-40°C ~ 125°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC EV
MCU, FPGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
500MHz, 600MHz, 1.2GHz
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
-
XC7Z035-3FFG900E
IC SOC CORTEX-A9 800MHZ 900FCBGA
5+
$160.5634
10+
$149.8592
15+
$144.5070
数量
1,660 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
900-BBGA, FCBGA
900-FCBGA (31x31)
-
256KB
DMA
Zynq®-7000
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1GHz
Kintex™-7 FPGA, 275K Logic Cells
-
XCZU2CG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
5+
$464.7887
10+
$433.8028
15+
$418.3099
数量
1,658 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 100°C (TJ)
-
784-BFBGA, FCBGA
784-FCBGA (23x23)
-
256KB
DMA, WDT
Zynq® UltraScale+™ MPSoC CG
MCU, FPGA
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
-
M2S005S-TQG144
IC SOC CORTEX-M3 166MHZ 144TQFP
5+
$16.9014
10+
$15.7746
15+
$15.2113
数量
1,647 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
0°C ~ 85°C (TJ)
-
144-LQFP
144-TQFP (20x20)
128KB
64KB
-
SmartFusion®2
MCU, FPGA
ARM® Cortex®-M3
CANbus, Ethernet, I²C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
-

片上系统 (SoC)

片上系统(SoC)是指将计算机系统的各种组件集成到一颗芯片上的集成电路。它通常包括处理器核心、存储器、输入输出接口和其他必要的外设,以支持系统的运作。SoC技术使得嵌入式系统变得紧凑、功耗低且高度集成。 功能和特点:SoC将多个系统组件集成到一颗芯片中,以紧凑的形态提供完整的解决方案。它们通常包括处理器核心,如ARM Cortex-A系列或RISC-V核心,以及存储器单元(RAM和/或闪存)、输入输出接口(USB、以太网、UART等)、定时器、中断、模数转换器(ADC)和其他特定应用所需的外设。SoC可以根据应用需求进行定制和编程,以执行各种功能。 使用场景:SoC广泛应用于对空间、功耗效率和集成度要求较高的嵌入式系统中。它们在众多场景中发挥作用,包括消费电子(智能手机、平板电脑、智能电视)、汽车系统(信息娱乐、发动机控制、高级驾驶辅助系统)、工业自动化、医疗设备、物联网设备等。SoC能够开发功能丰富、紧凑、具有成本效益的嵌入式系统。 应用领域:SoC在各个行业和领域中被广泛应用。在消费电子领域,SoC为智能手机、平板电脑、可穿戴设备和家用电器提供动力。汽车系统依赖SoC实现车载娱乐、导航和安全功能。工业自动化利用SoC进行控制系统、机器人和监测设备。医疗设备,如植入式设备和诊断工具,受益于SoC提供的紧凑性和集成性。SoC在物联网设备中也起着重要作用,实现了连接性、传感器集成和智能处理。 关键优势: 集成度:SoC将多个系统组件集成到一颗芯片中,减小了尺寸、复杂度和功耗。 紧凑性:将各种组件组合到一颗芯片上,实现了紧凑和便携的嵌入式系统。 功耗效率:SoC设计优化了功耗,适用于电池供电和节能应用。 可定制性:SoC可以定制和编程,以满足特定的应用需求,提供灵活性和适应性。 成本效益:SoC通过将多个组件集成到一颗芯片上,减少了对额外硬件的需求,提供了经济实惠的解决方案。 总而言之,嵌入式系统片上系统(SoC)是将多个系统组件集成到一颗芯片上的集成电路。SoC具有紧凑性、功耗低、可定制性和成本效益等特点,非常适用于各行业中各种嵌入式系统应用。