插座适配器

结果:
279
Manufacturer
Series
Number of Pins
Convert From (Adapter End)
Convert To (Adapter End)
Pitch - Mating
Contact Finish - Mating
Housing Material
Pitch - Post
Contact Finish - Post
Termination
Mounting Type
Board Material
结果279
选择
图片产品详情单价可用性ECAD 模型SeriesConvert From (Adapter End)Convert To (Adapter End)Number of PinsPitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostHousing MaterialBoard Material
LCQT-QFP0.65-52
SOCKET ADAPTER MULT PKG TO 52QFP
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip®
Multiple Packages
QFP
52
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
18-35W000-11-RC
SOCKET ADAPT SOIC-W TO 18DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
24-35W000-11-RC
SOCKET ADAPT SOIC-W TO 24DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
20-350001-10
SOCKET ADAPTER SOJ TO 20DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 350000
SOJ
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
24-665000-00
SCK ADAPT 24P SOIC-W TO SOIC 0.6
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 665000
SOIC-W
SOIC
24
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
24-351000-11-RC
SOCKET ADAPTER SSOP TO 24DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 351000
SSOP
DIP, 0.3" (7.62mm) Row Spacing
24
0.026" (0.65mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
1109522
SOCKET ADAPTER DIP TO TO-8
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1109522
DIP, 0.3" (7.62mm) Row Spacing
JEDEC
8
0.100" (2.54mm)
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
08-354000-10
CONN ADAPTER 8POS DIP-S01C
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
8
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1111841
SOCKET MSOP TO SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 1111841
MSOP
DIP, 0.3" (7.62mm) Row Spacing
-
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-354W00-10
CONN ADAPTER 16PIN DIP TO SOWIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354W00
DIP, 0.3" (7.62mm) Row Spacing
SOWIC
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-35W000-10
SOCKET ADAPT SOIC-W TO 14DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
14
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-35W000-11-RC
SOCKET ADAPT SOIC-W TO 16DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 35W000
SOIC-W
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
16-304235-10
16-PIN SOCKET TO PIN ADAPTER
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 304235
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
-
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
14-354000-21-RC
SOCKET ADAPTER DIP TO 14SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
14
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-350000-10-HT
SOCKET ADAPTER SOIC TO 8DIP 0.3
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 350000
SOIC
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
16-354000-10
CONN ADAPTER 16POS DIP-SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
16
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-666000-00
SOCKET ADAPTER SOIC TO 14SOWIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 666000
SOIC
SOWIC
14
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
16-354000-20
SOCKET ADAPTER DIP TO 16SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
16
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
16-354000-21-RC
SOCKET ADAPTER DIP TO 16SOIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 354000
DIP, 0.3" (7.62mm) Row Spacing
SOIC
16
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-666000-00
SOCKET ADAPTER SOIC TO 18SOWIC
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数量
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PCB Symbol, Footprint & 3D Model
Correct-A-Chip® 666000
SOIC
SOWIC
18
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass

关于  插座适配器

插座在电子电路中起着至关重要的作用,它使集成电路(IC)和晶体管能够反复插入、拆卸、替换和更换。插座提供了一个灵活的接口,便于不同封装类型的顺畅集成,确保电子系统设计和维护的灵活性和适应性。 插座适配器是有价值的附件,通过允许使用为一种封装类型设计的元件来替代另一种封装类型,扩展了IC和晶体管的兼容性和互换性。这种能力增强了电子系统的多功能性,并简化了现有电路设计的升级或修改过程。 例如,插座适配器可以将8引脚双列直插封装(DIP)适配为联合电子设备工程委员会(JEDEC)插座封装,提供了不同封装标准之间的桥梁,便于元件的互换使用。 此外,插座适配器支持将流行的表面贴装和通孔封装类型(如球栅阵列封装(BGA)、塑料引线芯片载体(PLCC)、四面体平封装(QFP)、小外形集成电路(SOIC)和收缩小外形集成电路(SOWIC))转换为DIP和JEDEC格式。这种广泛的兼容性确保了各种IC和晶体管可以集成到电子电路中,无论其原始封装设计如何。 通过提供在不同封装类型之间无缝适应的能力,插座适配器使设计师和工程师能够优化元件选择和利用,从而提高电子系统的灵活性和寿命。这种适应性有助于实现高效的系统维护、升级和在各种电子应用中的兼容性。