WLSC 系列, 硅电容器

结果:
16
Manufacturer
Series
Capacitance
Size / Dimension
Package / Case
Voltage - Breakdown
Height
Features
ESL (Equivalent Series Inductance)
Tolerance
ESR (Equivalent Series Resistance)
Operating Temperature
Applications
结果16
搜索条目:
WLSC
选择
图片产品详情单价可用性ECAD 模型ToleranceOperating TemperatureCapacitanceESR (Equivalent Series Resistance)Package / CaseSeriesVoltage - BreakdownESL (Equivalent Series Inductance)ApplicationsFeaturesHeightSize / Dimension
935146528247-W0T
CAP SILICON 47PF 15% 150V 0201
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数量
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PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
47 pF
50 mOhms
0201 (0603 Metric)
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.020" L x 0.010" W (0.50mm x 0.25mm)
935146521310-T3T
CAP SILICON 100PF 15% 150V 0202
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
100 pF
50 mOhms
0202 (0505 Metric)
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146831510-T3T
CAP SILICON 10000PF 15% 30V 0202
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
10000 pF
50 mOhms
0202 (0505 Metric)
WLSC
30 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146832410-W0T
CAP SILICON 1000PF 15% 30V SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
1000 pF
50 mOhms
Nonstandard Chip
WLSC
30 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146632410-W0T
CAP SILICON 1000PF 15% 50V SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
1000 pF
50 mOhms
Nonstandard Chip
WLSC
50 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.012" L x 0.012" W (0.29mm x 0.29mm)
935146529315-W0T
CAP SILICON 150PF 15% 150V SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
150 pF
50 mOhms
Nonstandard Chip
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.015" L x 0.015" W (0.38mm x 0.38mm)
935146522310-W0T
CAP SILICON 100PF 15% 150V SMD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
100 pF
50 mOhms
Nonstandard Chip
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146521410-T3T
CAP SILICON 1000PF 15% 150V 0202
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
±15%
-55°C ~ 150°C
1000 pF
50 mOhms
0202 (0505 Metric)
WLSC
150 V
50pH
High Stability, Vertical Silicon Cap, Wirebond
High Reliability, Low Profile
0.005" (0.12mm)
0.020" L x 0.020" W (0.50mm x 0.50mm)
935146837522-T3T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
0.022 µF
-
0402 (1005 Metric)
WLSC
30 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.005" (0.12mm)
0.039" L x 0.020" W (1.00mm x 0.50mm)
935246520427-T3T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
2700 pF
-
Nonstandard Chip
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.004" (0.10mm)
0.020" L x 0.079" W (0.50mm x 2.00mm)
935246521437-T3T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
3700 pF
-
Nonstandard Chip
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
-
0.010" (0.25mm)
0.020" L x 0.049" W (0.50mm x 1.25mm)
935146632322-W0T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
220 pF
-
Nonstandard Chip
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146632327-W0T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
270 pF
-
Nonstandard Chip
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146632347-W0T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
470 pF
-
Nonstandard Chip
WLSC
50 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.005" (0.12mm)
0.010" L x 0.010" W (0.25mm x 0.25mm)
935146050510-T3T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
10000 pF
-
0303 (0808 Metric)
WLSC
100 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.004" (0.10mm)
0.031" L x 0.031" W (0.80mm x 0.80mm)
935246522447-T3T
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-55°C ~ 150°C
4700 pF
-
Nonstandard Chip
WLSC
150 V
-
High Stability, Vertical Silicon Cap, Wirebond
Low Profile
0.010" (0.25mm)
0.020" L x 0.064" W (0.50mm x 1.63mm)

关于  硅电容器

硅和薄膜电容器是使用与半导体器件生产常见的工具、方法和材料制造的专用设备。这使得能够生产具有接近理想特性和出色参数稳定性的电容器。然而,这些电容器可用的数值范围有限且相对于陶瓷基电容器来说价格较高,后者是其主要竞争对手。 硅和薄膜电容器的制造过程允许对生产参数进行极高精度和控制。这导致电容器在电容值、电压额定值和其他电学特性方面表现出很好的稳定性。它们被设计为在时间和不同条件下维持其指定数值,因此适用于需要精确和可靠性能的应用。 尽管具有这些优点,与陶瓷基电容器相比,硅和薄膜电容器的可用电容值范围相对较窄。这种限制可能会限制它们在某些需要更多电容选项的应用中的使用。 此外,由于涉及专门的工艺和材料,硅和薄膜电容器的制造成本通常较高。因此,相对于陶瓷基替代品,这些电容器经常被认为成本更高。 总之,硅和薄膜电容器是使用半导体制造技术生产的电容器,可创造出具有接近理想特性和优异参数稳定性的电容器。虽然它们的电容值范围有限,但非常适合需要精确和可靠性能的应用。但是,在选择适当的电容器时,与陶瓷基电容器相比较高的成本是一个重要的考虑因素。