选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Grade | Flash Size | RAM Size | Speed | Peripherals | Architecture | Connectivity | Package / Case | Supplier Device Package | Primary Attributes | Core Processor | Qualification | Series |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | FPGA - 4.047M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 4M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | - | FPGA - 2.7M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.7M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 2.7M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | -40°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | FPGA - 1.9M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0°C ~ 100°C (TJ) | - | - | 256KB | 1.4GHz | DMA, WDT | MPU, FPGA | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | FPGA - 2.2M Logic Elements | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | Agilex I |
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