i.MX8Q 系列, 微处理器
结果:
24
Manufacturer
Series
Supplier Device Package
Package / Case
Core Processor
Speed
Security Features
Additional Interfaces
Number of Cores/Bus Width
Display & Interface Controllers
Operating Temperature
USB
Ethernet
RAM Controllers
Co-Processors/DSP
Grade
Mounting Type
Qualification
Voltage - I/O
Graphics Acceleration
SATA
结果：24
搜索条目:
i.MX8Q
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Ethernet | Operating Temperature | Voltage - I/O | Grade | Core Processor | Number of Cores/Bus Width | Speed | RAM Controllers | Graphics Acceleration | SATA | Package / Case | Supplier Device Package | Security Features | Display & Interface Controllers | Co-Processors/DSP | USB | Qualification | Series | Additional Interfaces |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 1Gbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 | 8 Core, 64-Bit | 1.6GHz, 1.2GHz, 264MHz | LPDDR4 | Yes | - | 1313-BFBGA | 1313-BGA (29x29) | A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS | DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON | USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) | - | i.MX8Q | CANbus, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | -40°C ~ 125°C (TJ) | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 417-BFBGA | 417-FBGA (17x17) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | 10/100/1000Mbps (2) | - | 1.8V, 2.5V, 3.3V | - | ARM® Cortex®-A53, ARM® Cortex®-M4F | 3 Core, 64-Bit | 1.2GHz, 264MHz | DDR3L SDRAM, LPDDR4 DRAM | Yes | - | 609-BFBGA | 609-FBGA (21x21) | - | LCD, LVDS, MIPI-CSI, MIPI-DSI | Multimedia; NEON, Hi-Fi4 DSP | USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) | - | i.MX8Q | - |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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