RZ/V2L 系列, 微处理器
结果:
14
Manufacturer
Series
Supplier Device Package
Package / Case
Number of Cores/Bus Width
Display & Interface Controllers
Core Processor
Speed
Operating Temperature
Security Features
USB
Grade
Mounting Type
Qualification
Additional Interfaces
Ethernet
RAM Controllers
Voltage - I/O
Graphics Acceleration
SATA
Co-Processors/DSP
结果：14
搜索条目:
RZ/V2L
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Mounting Type | Operating Temperature | Ethernet | USB | Voltage - I/O | Grade | Core Processor | Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | Security Features | Package / Case | Supplier Device Package | Qualification | Series | Additional Interfaces |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 551-LFBGA | 551-LFBGA (21x21) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | -40°C ~ 85°C (TA) | 10/100/1000Mbps (2) | USB 2.0 (2) | 1.8V, 3.3V | - | ARM® Cortex®-A55, ARM® Cortex®-M33 | 3 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | - | - | 456-LFBGA | 456-LFBGA (15x15) | - | RZ/V2L | CANbus, eMMC/SD/SDIO, I2C, SPI, UART |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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