MPC82xx 系列, 微处理器
结果:
347
Manufacturer
Series
Speed
Package / Case
Additional Interfaces
Supplier Device Package
Core Processor
Operating Temperature
Ethernet
RAM Controllers
Co-Processors/DSP
Security Features
USB
Mounting Type
Display & Interface Controllers
Grade
Qualification
Number of Cores/Bus Width
Voltage - I/O
Graphics Acceleration
SATA
结果：347
搜索条目:
MPC82xx
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Ethernet | USB | Operating Temperature | Voltage - I/O | Package / Case | Series | Core Processor | Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | Security Features | Supplier Device Package |
|---|
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | -40°C ~ 105°C (TA) | 3.3V | 352-LBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 333MHz | - | SDRAM | No | - | - | - | 352-TBGA (35x35) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 166MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | -40°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0°C ~ 85°C (TA) | 3.3V | 352-LBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 400MHz | - | SDRAM | No | - | - | - | 352-TBGA (35x35) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0°C ~ 85°C (TA) | 3.3V | 352-LBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 400MHz | - | SDRAM | No | - | - | - | 352-TBGA (35x35) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | -40°C ~ 105°C (TA) | 3.3V | 357-BBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 166MHz | - | SDRAM | No | - | - | - | 357-PBGA (25x25) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | -40°C ~ 105°C (TA) | 3.3V | 357-BBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | 357-PBGA (25x25) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0°C ~ 105°C (TA) | 3.3V | 352-LBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 300MHz | - | SDRAM | No | - | - | - | 352-TBGA (35x35) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | 0°C ~ 105°C (TA) | 3.3V | 357-BBGA | MPC82xx | PowerPC 603e | 1 Core, 32-Bit | 266MHz | - | SDRAM | No | - | - | - | 357-PBGA (25x25) | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | USB 2.0 (1) | 0°C ~ 105°C (TJ) | 3.3V | 516-BBGA | MPC82xx | PowerPC G2_LE | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 516-PBGA (27x27) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 10/100Mbps (3) | - | 0°C ~ 105°C (TA) | 3.3V | 480-LBGA Exposed Pad | MPC82xx | PowerPC G2 | 1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | - | - | 480-TBGA (37.5x37.5) |
关于 微处理器
微处理器是专门设计用于嵌入式系统的微处理器，这些系统是为在设备或机械中执行特定任务而定制的计算机系统。这些微处理器经过优化，以实现低功耗、实时处理和与其他组件无缝集成。它们的功能在于提供计算能力和控制能力，通常配备定制的外设、接口或指令集，以满足应用的特定要求。
它们在各个领域中都有应用，包括汽车电子（发动机控制单元、信息娱乐系统）、工业自动化（可编程逻辑控制器、机器人控制）、医疗设备（患者监测系统、可植入设备）、消费电子（智能手机、可穿戴设备）和家庭自动化。嵌入式微处理器支持这些行业的多样化计算需求，提供量身定制的性能和功能，推动现代嵌入式系统的运作。
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