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|  | IC MPU I.MX8ML 1.8GHZ 548LFBGA | | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | 0°C ~ 95°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.8GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
|  | | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | -40°C ~ 105°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.6GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, PCIe, SDHC, SPI, UART |
| | | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | 0°C ~ 95°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.8GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 486-LFBGA | 486-LFBGA (14x14) | - | CAN, I2C, PCIe, SDHC, SPI, UART |
| | | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | -40°C ~ 105°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.8GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
| | | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | 0°C ~ 95°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 2 Core, 64-Bit | 1.8GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 486-LFBGA | 486-LFBGA (14x14) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
| | IC I.MX 8M PLUS QUADLITE BGA | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | -40°C ~ 105°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.6GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
| | | | | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | -40°C ~ 105°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 2 Core, 64-Bit | 1.6GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Surface Mount | GbE (2) | - | 0°C ~ 95°C (TJ) | - | ARM® Cortex®-A53 | i.MX8ML | 4 Core, 64-Bit | 1.8GHz | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP | DDR4, LPDDR4 | Yes | HTML, LVDS, MIPI-CSI, MIPI-DSI | - | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM TZ, CAAM, RDC | 548-LFBGA | 548-LFBGA (15x15) | - | CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
