IC插座

结果:
23,974
Manufacturer
Series
Number of Positions or Pins (Grid)
Type
Housing Material
Contact Finish Thickness - Post
Contact Finish Thickness - Mating
Operating Temperature
Features
Pitch - Post
Pitch - Mating
Contact Material - Post
Mounting Type
Contact Finish - Post
Contact Material - Mating
Contact Finish - Mating
Termination
结果23,974
选择
图片产品详情单价可用性ECAD 模型Mounting TypePitch - MatingContact Finish - MatingTerminationPitch - PostContact Finish - PostOperating TemperatureHousing MaterialTypeNumber of Positions or Pins (Grid)SeriesContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
PLCC-032-T-N-TR
CONN SOCKET PLCC 32POS TIN
1+
$7.6056
5+
$7.1831
10+
$6.7606
数量
40 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Surface Mount
0.050" (1.27mm)
Tin
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Liquid Crystal Polymer (LCP)
PLCC
32 (2 x 7, 2 x 9)
PLCC
-
Beryllium Copper
Closed Frame
-
Beryllium Copper
1571541-4
CONN SOCKET PLCC 84POS TIN
1+
$7.6056
5+
$7.1831
10+
$6.7606
数量
28 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-
Polyphenylene Sulfide (PPS)
PLCC
84 (4 x 21)
PCS
180.0µin (4.57µm)
Copper Alloy
Closed Frame
180.0µin (4.57µm)
Copper Alloy
110-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
1+
$0.5070
5+
$0.4789
10+
$0.4507
数量
27 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
110
Flash
Beryllium Copper
Open Frame
-
Brass
110-87-316-41-001101
CONN IC DIP SOCKET 16POS GOLD
1+
$2.0282
5+
$1.9155
10+
$1.8028
数量
25 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
110
Flash
Beryllium Copper
Open Frame
-
Brass
3-1571552-6
824-AG31D-ESL-LF=800 DIP GF/SN
1+
$2.8901
5+
$2.7296
10+
$2.5690
数量
10 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
1-2199299-2
28P,DIP SKT,600 CL,LDR,PB FREE
1+
$0.5070
5+
$0.4789
10+
$0.4507
数量
10 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
Polybutylene Terephthalate (PBT), Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
Diplomate DL
60.0µin (1.52µm)
Phosphor Bronze
Open Frame
60.0µin (1.52µm)
Nickel
XR2A-0811-N
CONN IC DIP SOCKET 8POS GOLD
1+
$1.2676
5+
$1.1972
10+
$1.1268
数量
3 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Polybutylene Terephthalate (PBT), Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
XR2
10.0µin (0.25µm)
Beryllium Copper
Open Frame
10.0µin (0.25µm)
Beryllium Copper
264-4493-00-0602J
CONN IC DIP SOCKET ZIF 64POS GLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Connector
0.100" (2.54mm)
Gold
Press-Fit
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Polysulfone (PSU), Glass Filled
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
Textool™
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
16-810-90T
CONN IC DIP SOCKET 16POS TIN
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Vertical
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-
Polyamide (PA46), Nylon 4/6
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
Vertisockets™ 800
200.0µin (5.08µm)
Phosphor Bronze
Closed Frame
200.0µin (5.08µm)
Phosphor Bronze
12-810-90C
CONN IC DIP SOCKET 12POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Vertical
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-
Polyamide (PA46), Nylon 4/6, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
Vertisockets™ 800
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
115-87-314-41-003101
CONN IC DIP SOCKET 14POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
115
Flash
Beryllium Copper
Open Frame
-
Brass
110-83-632-41-605101
CONN IC DIP SOCKET 32POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
110
29.5µin (0.75µm)
Beryllium Copper
Open Frame
-
Brass
4816-3004-CP
CONN IC DIP SOCKET 16POS TIN
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Tin
Solder
0.100" (2.54mm)
Tin
-25°C ~ 85°C
Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
4800
35.4µin (0.90µm)
Phosphor Bronze
Open Frame
35.0µin (0.90µm)
Phosphor Bronze
110-87-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
110
Flash
Beryllium Copper
Open Frame
-
Brass
WMS-080Z
CONN IC DIP SOCKET 8POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin
-40°C ~ 105°C
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
WMS
Flash
Beryllium Copper
Open Frame, Wash Away
200.0µin (5.08µm)
Brass
1-1825108-2
CONN IC DIP SOCKET 28POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Thermoplastic, Glass Filled
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
Diplomate DL
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
1-1825093-2
CONN IC DIP SOCKET 8POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Gold
-55°C ~ 125°C
Thermoplastic, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
Diplomate DL
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
30.0µin (0.76µm)
Beryllium Copper
514-AG7D
CONN IC DIP SOCKET 14POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole, Right Angle, Horizontal
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
Tin-Lead
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
-
25.0µin (0.63µm)
Beryllium Copper
Closed Frame
25.0µin (0.63µm)
Brass
D0806-42
CONN IC DIP SOCKET 6POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Wire Wrap
0.100" (2.54mm)
Tin
-55°C ~ 125°C
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
D0
10.0µin (0.25µm)
Beryllium Copper
Open Frame
196.9µin (5.00µm)
Brass
528-AG10D-ES
CONN IC DIP SOCKET 28POS GOLD
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
Through Hole
0.100" (2.54mm)
Gold
Solder
0.100" (2.54mm)
-
-55°C ~ 125°C
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
500
-
Beryllium Copper
Closed Frame
-
Brass

IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。