IC插座

结果:
315
Series
Number of Positions or Pins (Grid)
Contact Finish - Mating
Contact Finish Thickness - Mating
Type
Housing Material
Contact Finish - Post
Features
Operating Temperature
Contact Material - Post
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Material - Mating
Pitch - Mating
结果315
搜索条目:
Amphenol ICC (FCI)
选择
图片产品详情单价可用性ECAD 模型SeriesOperating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)TypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - PostHousing Material
DIP632-001BLF
CONN IC DIP SOCKET 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (2 x 16)
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X17-157BLF
CONN SOCKET SIP 17POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X09-160BLF
CONN SOCKET SIP 9POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X17-160BLF
CONN SOCKET SIP 17POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X25-157BLF
CONN SOCKET SIP 25POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
25 (1 x 25)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X08-157BLF
CONN SOCKET SIP 8POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
8 (1 x 8)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X14-157BLF
CONN SOCKET SIP 14POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X21-157BLF
CONN SOCKET SIP 21POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
21 (1 x 21)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X32-160BLF
CONN SOCKET SIP 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X16-160BLF
CONN SOCKET SIP 16POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X18-160BLF
CONN SOCKET SIP 18POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (1 x 18)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X31-160BLF
CONN SOCKET SIP 31POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
31 (1 x 31)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X31-157BLF
CONN SOCKET SIP 31POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
31 (1 x 31)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X21-160BLF
CONN SOCKET SIP 21POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
21 (1 x 21)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X27-160BLF
CONN SOCKET SIP 27POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X16-041BLF
CONN SOCKET SIP 16POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
SIP1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
DPF314-998Z
CONN IC DIP SOCKET 14POS TINLEAD
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数量
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PCB Symbol, Footprint & 3D Model
DPF3
-
0.100" (2.54mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
14 (2 x 7)
DIP, 0.3" (7.62mm) Row Spacing
200.0µin (5.08µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF
CONN SOCKET SIP 2POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
SIP1x
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
DIP628-014BLF
CONN IC DIP SOCKET 28POS TIN
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
DIP, 0.6" (15.24mm) Row Spacing
100.0µin (2.54µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1X18-157BLF
CONN SOCKET SIP 18POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
SIP050-1x
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (1 x 18)
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。