IC插座

结果:
315
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Type
Contact Finish - Mating
Housing Material
Features
Operating Temperature
Contact Material - Post
Termination
Mounting Type
Contact Finish Thickness - Post
Pitch - Post
Contact Finish - Post
Contact Material - Mating
Pitch - Mating
结果315
搜索条目:
Amphenol ICC (FCI)
选择
图片产品详情单价可用性ECAD 模型Operating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
SIP1X20-011BLF
CONN SOCKET SIP 20POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
DIP640-001BLF
CONN IC DIP SOCKET 40POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
SIP1X16-011BLF
CONN SOCKET SIP 16POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X02-001BLF
CONN SOCKET SIP 2POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X10-001BLF
CONN SOCKET SIP 10POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X17-001BLF
CONN SOCKET SIP 17POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
17 (1 x 17)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
DIP328-014BLF
CONN IC DIP SOCKET 28POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP328-011BLF
CONN IC DIP SOCKET 28POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP324-014BLF
CONN IC DIP SOCKET 24POS TIN
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP318-011BLF
CONN IC DIP SOCKET 18POS GOLD
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数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
18 (2 x 9)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP316-011BLF
CONN IC DIP SOCKET 16POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP324-011BLF
CONN IC DIP SOCKET 24POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
SIP1X20-001BLF
CONN SOCKET SIP 20POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
DIP314-001BLF
CONN IC DIP SOCKET 14POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (2 x 7)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP316-001BLF
CONN IC DIP SOCKET 16POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP324-001BLF
CONN IC DIP SOCKET 24POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP316-014BLF
CONN IC DIP SOCKET 16POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (2 x 8)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.3" (7.62mm) Row Spacing
100.0µin (2.54µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
SIP1X20-041BLF
CONN SOCKET SIP 20POS GOLD
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
20 (1 x 20)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP050-1X04-157BLF
CONN SOCKET SIP 4POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
4 (1 x 4)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP050-1X27-157BLF
CONN SOCKET SIP 27POS TIN
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP050-1x
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。