选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Operating Temperature | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Number of Positions or Pins (Grid) | Housing Material | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 40 (2 x 20) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (1 x 16) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 10.0µin (0.25µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 2 (1 x 2) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 10 (1 x 10) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 17 (1 x 17) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 100.0µin (2.54µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 28 (2 x 14) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 100.0µin (2.54µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 18 (2 x 9) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (2 x 8) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 14 (2 x 7) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (2 x 8) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 24 (2 x 12) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 16 (2 x 8) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | DIP, 0.3" (7.62mm) Row Spacing | 100.0µin (2.54µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Tin | 20 (1 x 20) | Polyphenylene Sulfide (PPS), Glass Filled | SIP1x | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 4 (1 x 4) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | SIP050-1x | SIP | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | 27 (1 x 27) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | SIP050-1x | SIP | 200.0µin (5.08µm) | Beryllium Copper | Closed Frame | 200.0µin (5.08µm) | Brass |
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