IC插座

结果:
315
Series
Number of Positions or Pins (Grid)
Contact Finish Thickness - Mating
Contact Material - Post
Housing Material
Operating Temperature
Contact Finish Thickness - Post
Type
Contact Material - Mating
Contact Finish - Mating
Mounting Type
Pitch - Post
Features
Pitch - Mating
Termination
Contact Finish - Post
结果315
搜索条目:
Amphenol ICC (FCI)
选择
图片产品详情单价可用性ECAD 模型Operating TemperaturePitch - MatingContact Finish - MatingMounting TypeTerminationPitch - PostContact Finish - PostNumber of Positions or Pins (Grid)Housing MaterialSeriesTypeContact Finish Thickness - MatingContact Material - MatingFeaturesContact Finish Thickness - PostContact Material - Post
SIP1X32-014BLF
CONN SOCKET SIP 32POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X09-001BLF
CONN SOCKET SIP 9POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
9 (1 x 9)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
30.0µin (0.76µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X27-014BLF
CONN SOCKET SIP 27POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
27 (1 x 27)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X16-014BLF
CONN SOCKET SIP 16POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
16 (1 x 16)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X03-011BLF
CONN SOCKET SIP 3POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
3 (1 x 3)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X14-011BLF
CONN SOCKET SIP 14POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
14 (1 x 14)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
DIP624-011BLF
CONN IC DIP SOCKET 24POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
24 (2 x 12)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
DIP640-011BLF
CONN IC DIP SOCKET 40POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
40 (2 x 20)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.6" (15.24mm) Row Spacing
10.0µin (0.25µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass
SIP1X32-011BLF
CONN SOCKET SIP 32POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
32 (1 x 32)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X15-014BLF
CONN SOCKET SIP 15POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
150.0µin (3.81µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X10-011BLF
CONN SOCKET SIP 10POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
10 (1 x 10)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
SIP1X15-011BLF
CONN SOCKET SIP 15POS GOLD
联系我们
数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
15 (1 x 15)
Polyphenylene Sulfide (PPS), Glass Filled
SIP1x
SIP
10.0µin (0.25µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Brass
69802-128LF
CONN SOCKET PLCC 28POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
28 (4 x 7)
Polyphenylene Sulfide (PPS)
-
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
69802-120LF
CONN SOCKET PLCC 20POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
20 (4 x 5)
Polyphenylene Sulfide (PPS)
-
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
69802-168LF
CONN SOCKET PLCC 68POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-55°C ~ 125°C
0.050" (1.27mm)
Tin
Surface Mount
Solder
0.050" (1.27mm)
Tin
68 (4 x 17)
Polyphenylene Sulfide (PPS)
-
PLCC
150.0µin (3.81µm)
Phosphor Bronze
Closed Frame
150.0µin (3.81µm)
Phosphor Bronze
54020-68030LF
CONN SOCKET PLCC 68POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-40°C ~ 105°C
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
68 (4 x 17)
Polyphenylene Sulfide (PPS)
-
PLCC
100.0µin (2.54µm)
Copper Alloy
Closed Frame
100.0µin (2.54µm)
Copper Alloy
54020-52030LF
CONN SOCKET PLCC 52POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-40°C ~ 105°C
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
52 (4 x 13)
Polyphenylene Sulfide (PPS)
-
PLCC
100.0µin (2.54µm)
Copper Alloy
Closed Frame
100.0µin (2.54µm)
Copper Alloy
54020-84030LF
CONN SOCKET PLCC 84POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-40°C ~ 105°C
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin
84 (4 x 21)
Polyphenylene Sulfide (PPS)
-
PLCC
100.0µin (2.54µm)
Copper Alloy
Closed Frame
100.0µin (2.54µm)
Copper Alloy
SIP41430-001LF
CONN SOCKET SIP 2POS TIN
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Tin
Surface Mount
Solder
0.100" (2.54mm)
Tin
2 (1 x 2)
Polyamide (PA), Nylon
-
SIP
200.0µin (5.08µm)
Beryllium Copper
Closed Frame
200.0µin (5.08µm)
Beryllium Copper
DIP628-001BLF
CONN IC DIP SOCKET 28POS GOLD
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数量
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PCB Symbol, Footprint & 3D Model
-
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
28 (2 x 14)
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
DIP, 0.6" (15.24mm) Row Spacing
30.0µin (0.76µm)
Beryllium Copper
Open Frame
200.0µin (5.08µm)
Brass

关于  IC插座

插座在电路中起到了重要的作用,它们便于重复插入、拆卸、替换和更换集成电路(IC)和晶体管。它们为这些电子元件提供了一个安全和适应性强的接口,便于维护和升级。 插座有多种安装类型,包括机箱、面板、连接器、板表面和通孔,可在不同的电子系统中灵活安装和使用。每种安装类型都满足特定的应用需求,确保兼容性和可靠性能。 除了安装类型外,插座还具有板导向、载体、法兰、开放框架和封闭框架等特点,这些特点有助于提高插入的IC或晶体管的稳定性、对齐度和保护性。这些特点设计用于增强插座在各种工作环境下的整体功能和可靠性。 此外,插座还通过引脚间距、接触材料和表面处理、接线方式和接触表面等进行区分,以实现根据具体的电气和机械要求进行定制。这些属性的变化确保插座能够适应具有不同规格和配置的各种IC和晶体管。 通过考虑引脚间距、接触材料、接线方式和接触表面等因素,用户可以选择最适合其应用需求的插座,确保最佳的电气性能和机械兼容性。 总之,插座是实现集成电路和晶体管在电子电路中灵活可靠集成的关键组件。它们的多种安装类型、特点和定制选项使它们在需要频繁插拔和更换元件的应用中不可或缺。