选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Number of Positions or Pins (Grid) | Housing Material | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 40 (2 x 20) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Closed Frame | 15.0µin (0.38µm) | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 16 (2 x 8) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (2 x 16) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 24 (2 x 12) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 40 (2 x 20) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 1 可用 可以立即发货 发货地: HK | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 28 (2 x 14) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 24 (2 x 12) | Thermoplastic | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | Thermoplastic | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 40 (2 x 20) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 24 (2 x 12) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 8 (1 x 8) | Thermoplastic, Glass Filled | Diplomate DL | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (1 x 20) | Thermoplastic, Glass Filled | Diplomate DL | SIP | 30.0µin (0.76µm) | Beryllium Copper | Closed Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 32 (2 x 16) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 30.0µin (0.76µm) | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 7 (1 x 7) | Thermoplastic, Glass Filled | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 12 (1 x 12) | Thermoplastic, Glass Filled | Diplomate DL | SIP | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 13 (1 x 13) | Thermoplastic, Glass Filled | Diplomate DL | SIP | - | Phosphor Bronze | Closed Frame | - | Phosphor Bronze | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 8 (2 x 4) | Thermoplastic | Diplomate DL | DIP, 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Closed Frame | - | Beryllium Copper | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 48 (2 x 24) | Thermoplastic, Glass Filled | Diplomate DL | DIP, 0.6" (15.24mm) Row Spacing | 15.0µin (0.38µm) | Phosphor Bronze | Open Frame | 15.0µin (0.38µm) | Phosphor Bronze |
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