选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Pitch - Mating | Contact Finish - Mating | Mounting Type | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Number of Positions or Pins (Grid) | Series | Type | Contact Finish Thickness - Mating | Contact Material - Mating | Features | Contact Finish Thickness - Post | Contact Material - Post | Housing Material |
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![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | Through Hole | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | 50 (2 x 25) | 123 | DIP, 0.9" (22.86mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 64 (2 x 32) | 123 | DIP, 0.9" (22.86mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 50 (2 x 25) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 28 (2 x 14) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 48 (2 x 24) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 52 (2 x 26) | 123 | DIP, 0.6" (15.24mm) Row Spacing | Flash | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 28 (2 x 14) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 28 (2 x 14) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 24 (2 x 12) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 50 (2 x 25) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 50 (2 x 25) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | Through Hole | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | 42 (2 x 21) | 123 | DIP, 0.6" (15.24mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 16 (2 x 8) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 48 (2 x 24) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 10.0µin (0.25µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | Through Hole | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | 22 (2 x 11) | 123 | DIP, 0.3" (7.62mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 42 (2 x 21) | 123 | DIP, 0.6" (15.24mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 18 (2 x 9) | 123 | DIP, 0.3" (7.62mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame, Decoupling Capacitor | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | - | Through Hole | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | 22 (2 x 11) | 123 | DIP, 0.4" (10.16mm) Row Spacing | - | Beryllium Copper | Open Frame | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
![]() | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 0.100" (2.54mm) | Gold | Through Hole | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 20 (2 x 10) | 123 | DIP, 0.4" (10.16mm) Row Spacing | 30.0µin (0.76µm) | Beryllium Copper | Open Frame | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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