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|   | | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 300 Ohms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
|  | RES SMD 100K OHM 5% 1.5W 5025 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 180°C | - | 2 | 1.5W | ±5% | Thick Film | ±50ppm/°C | 0.142" (3.60mm) | 100 kOhms | - | High Voltage, Non-Inductive | - | Macrochip | Nonstandard | 0.500" L x 0.250" W (12.70mm x 6.35mm) |
|  | RES SMD 500M OHM 5% 1/4W 1206 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 0.25W, 1/4W | ±5% | Thick Film | ±250ppm/°C | 0.022" (0.55mm) | 500 mOhms | 1206 | High Voltage | - | HVC | 1206 (3216 Metric) | 0.126" L x 0.059" W (3.20mm x 1.50mm) |
|  | RES SMD 1K OHM 5% 5W L BEND | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 5W | ±5% | Wirewound | ±20ppm/°C | 0.406" (10.31mm) | 1 kOhms | - | - | - | RW | SMD, L-Bend | 0.806" L x 0.365" W (20.47mm x 9.27mm) |
| .jpg&w=256&q=75 "HVC0402Z2506JET") | RES SMD 250M OHM 5% 1/20W 0402 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 0.05W, 1/20W | ±5% | Thick Film | ±250ppm/°C | 0.014" (0.35mm) | 250 mOhms | 0402 | High Voltage | - | HVC | 0402 (1005 Metric) | 0.041" L x 0.020" W (1.04mm x 0.50mm) |
|  | RES SMD 5K OHM 5% 35W D2PAK | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 150°C | - | 2 | 35W | ±5% | Thick Film | ±50ppm/°C | 0.185" (4.70mm) | 5 kOhms | TO-263 (D2Pak) | Moisture Resistant | - | TDH35 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | 0.398" L x 0.378" W (10.10mm x 9.60mm) |
| | | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 47 Ohms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
|  | RES SMD 1 OHM 5% 1W J LEAD | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 150°C | - | 2 | 1W | ±5% | Wirewound | ±50ppm/°C | 0.141" (3.58mm) | 1 Ohms | SMD J-Lead, Pedestal | Current Sense | - | RW | 2512 J-Lead | 0.246" L x 0.136" W (6.25mm x 3.45mm) |
| | | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 10 Ohms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
|  | RES SMD 5M OHM 1% 1W 2512 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 200°C | - | 2 | 1W | ±1% | Thick Film | ±100ppm/°C | 0.032" (0.81mm) | 5 mOhms | 2512 | High Voltage, Moisture Resistant, Non-Magnetic | - | HVF | 2512 (6432 Metric) | 0.252" L x 0.126" W (6.40mm x 3.20mm) |
|  | TO-263 HEATSINKABLE THICK FILM R | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 50W | ±1% | Thick Film | - | 0.185" (4.70mm) | 50 Ohms | DPAK | Non-Inductive | - | TDH50 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | 0.406" L x 0.398" W (10.30mm x 10.10mm) |
|  | 1/8 WATTS PRECISION CHIP 200 OHM | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 0.125W, 1/8W | ±0.01% | Thin Film | ±5ppm/°C | 0.026" (0.65mm) | 200 Ohms | 1206 | - | - | APC | 1206 (3216 Metric) | 0.120" L x 0.061" W (3.05mm x 1.55mm) |
| | RES SMD 100 OHM 5% 5W L BEND | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 5W | ±5% | Wirewound | ±20ppm/°C | 0.406" (10.31mm) | 100 Ohms | - | - | - | RW | SMD, L-Bend | 0.806" L x 0.365" W (20.47mm x 9.27mm) |
| | | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 50 Ohms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
| | RES 2.5 KOHM 1% 45W TO252 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 2.5 kOhms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
|  | RES 0.36 OHM 1% 1/4W 0805 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 0.25W, 1/4W | ±1% | Metal Film | ±50ppm/°C | 0.026" (0.65mm) | 360 mOhms | 0805 | Current Sense | - | KDV | 0805 (2012 Metric) | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| | | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 175°C | - | 2 | 45W | ±1% | Thick Film | ±100ppm/°C | 0.039" (1.00mm) | 1 kOhms | TO-252 | Pulse Withstanding | - | TKH | PFC10 (TO-126 SMT) | 0.472" L x 0.323" W (12.00mm x 8.20mm) |
|  | RES 0.005 OHM 1% 1/2W 0805 | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 155°C | - | 2 | 0.5W, 1/2W | ±1% | Metal Element | ±75ppm/°C | 0.026" (0.65mm) | 5 mOhms | 0805 | Current Sense | - | LVT | 0805 (2012 Metric) | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
|  | RES 0.01 OHM 0.5% 3/4W 2010 | | | PCB Symbol, Footprint & 3D Model | -40°C ~ 125°C | - | 4 | 0.75W, 3/4W | ±0.5% | Thick Film | ±50ppm/°C | 0.026" (0.65mm) | 10 MOhms | 2010 | Anti-Corrosive, Current Sense, Moisture Resistant | - | LVK | 2010 (5025 Metric) | 0.197" L x 0.098" W (5.00mm x 2.50mm) |
| | RES SMD 200 OHM 5% 35W D2PAK | | | PCB Symbol, Footprint & 3D Model | -55°C ~ 150°C | - | 2 | 35W | ±5% | Thick Film | ±50ppm/°C | 0.185" (4.70mm) | 200 Ohms | TO-263 (D2Pak) | Moisture Resistant | - | TDH35 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | 0.398" L x 0.378" W (10.10mm x 9.60mm) |
