CLL 系列, 陶瓷电容器

结果:
52
Manufacturer
Series
Capacitance
Voltage - Rated
Size / Dimension
Temperature Coefficient
Package / Case
Operating Temperature
Thickness (Max)
Applications
Height - Seated (Max)
Tolerance
Lead Spacing
Mounting Type
Ratings
Features
Failure Rate
Lead Style
结果52
搜索条目:
CLL
选择
图片产品详情单价可用性ECAD 模型Height - Seated (Max)ToleranceOperating TemperatureRatingsPackage / CaseCapacitanceVoltage - RatedTemperature CoefficientMounting TypeApplicationsLead StyleFailure RateSeriesFeaturesThickness (Max)Lead SpacingSize / Dimension
CLLE1AX7S1A154M050AC
CAP CER 0.15UF 10V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.15 µF
10V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLE1AX7R0J105M085AC
CAP CER 1UF 6.3V X7R 0805
联系我们
数量
1 可用
可以立即发货
发货地: HK
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
1 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7S0G684M
CAP CER 0.68UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.68 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1A224M
CAP CER 0.22UF 10V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.22 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7S0J474M
CAP CER 0.47UF 6.3V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.47 µF
6.3V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLE1AX7S1A224M050AC
CAP CER 0.22UF 10V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.22 µF
10V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLE1AX7S0G225M050AC
CAP CER 2.2UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
2.2 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLE1AX7S0G225M085AC
CAP CER 2.2UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
2.2 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1C473M
CAP CER 0.047UF 16V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.047 µF
16V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1A104M
CAP CER 0.1UF 10V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.1 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1C683M
CAP CER 0.068UF 16V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.068 µF
16V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R0J334M
CAP CER 0.33UF 6.3V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.33 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1A334M
CAP CER 0.33UF 10V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.33 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R1A474M
CAP CER 0.47UF 10V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.47 µF
10V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7R0J684M
CAP CER 0.68UF 6.3V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.68 µF
6.3V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7S0G105M
CAP CER 1UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
1 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7S0G155M
CAP CER 1.5UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
1.5 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLD11X7S0G225M
CAP CER 2.2UF 4V X7S 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
2.2 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.037" (0.95mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLE1AX7R0G473M050AC
CAP CER 0.047UF 4V X7R 0805
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0805 (2012 Metric)
0.047 µF
4V
X7R
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.079" L x 0.049" W (2.00mm x 1.25mm)
CLLC1AX7S0G104M050AC
CAP CER 0.1UF 4V X7S 0603
联系我们
数量
联系我们
PCB Symbol, Footprint & 3D Model
-
±20%
-55°C ~ 125°C
-
0603 (1608 Metric)
0.1 µF
4V
X7S
Surface Mount, MLCC
Bypass, Decoupling
-
-
CLL
Low ESL (Multi-Terminal)
0.022" (0.55mm)
-
0.063" L x 0.031" W (1.60mm x 0.80mm)

关于  陶瓷电容器

电容器是必不可少的被动电子元件,具有存储电荷的能力。其中陶瓷电容器是利用陶瓷材料作为介质、金属层作为非极化电极构建而成。 陶瓷电容器在各种应用中得到广泛使用,包括汽车电子、旁路、解耦、滤波、射频(RF)电路和静电放电(ESD)保护等。它们因其小巧的尺寸、高电容值和在广泛频率范围内的优异性能而备受赞赏。 陶瓷电容器的插入式版本通常采用圆盘形或“块状”形状,并配有两根导线引脚,便于插入电路板。这种形式因方便焊接和牢固的机械连接而受到青睐。 陶瓷电容器具有许多优点,包括高可靠性、低成本以及在不同环境条件下的稳定性。这些电容器中使用的介质材料决定了其温度系数和电压特性。制造商通常会提供数据手册,指定电容值、电压等级、公差和其他重要参数,以帮助正确选择和应用。 总之,陶瓷电容器在电子领域被广泛用于汽车应用、信号滤波和ESD保护等各种用途。它们由陶瓷和金属交替层构成,插入式版本具有圆盘形或块状形状,并配有两根导线引脚,便于集成到电路板中。这些电容器表现出优异的性能、小巧的尺寸和可靠性,因此在电子设计中备受青睐。