congatec
Congatec是一家领先的工业计算机模块供应商，专注于为工业自动化、娱乐、医疗、交通和电信等各行业提供多样化的应用解决方案。该公司专注于利用包括COM Express、Qseven、SMARC和EDM服务在内的标准形式因素。成立于2004年，总部位于德国的Deggendorf，Congatec在全球范围内拥有额外的实体，分别位于美国、中国、台湾、日本、澳大利亚、英国、法国和捷克共和国。
嵌入式计算机配件
结果:
21
Series
Specifications
Accessory Type
结果：21
搜索条目:
congatec
选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Accessory Type | Series | Specifications |
|---|
  | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-QA5/I-CSP-B | Passive Cooling for Qseven Conga-QA5 Module with Lidded Intel Atom Processor, 2.7mm | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-QMX8/CSP-T | Passive Cooling for Qseven Conga-QMX8 Module with Lidded NXP i.MX8 ARM Cortex® A72 Processor, 2.5mm Thread | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-QA5/CSP-B | Passive Cooling for Qseven Conga-QA5 Module with open silicon Intel Pentium and Celeron Processors, 2.7mm | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Cable | - | Data cable for conga-LVDI LVDS to DVI adapter, dual row 2mm 34 pin 1mm pitch ribbon cable, length 15cm | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-TS170/HSP-HP-B | Heat Spreader for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 2.7mm | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-TS170/CSA-HP-B | Active Cooling for COM Express Conga-TS170/TS175 Module with Integrated Heat Pipes, 21mm High Heat Sink, and 12V Fan, 2.7mm | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | ||||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | ||||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | ||||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-PA5/I-CSP-T | Passive Cooling for for Pico-ITX conga-PA6, Lidded | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | ||||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-TCA5/I-CSP-B | Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.7mm | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-TCA5/CSP-B | Passive Cooling for COM Express Conga-TCA5 Compact Module with Lidded Intel Atom Processor, 2.5mm Thread | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Cable | - | |||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | ||||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | ||||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-IA5/CSP | Passive Cooling for for Mini-ITX conga IA5, (For modules with standard non lidded CP) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-IA5/I-CSP | Passive Cooling for for Mini-ITX conga-IA5 (For modules with IHS CPU) | ||
| 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Spreader | conga-SA5/HSP-B | Standard heat spreader for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | ||
 | 联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | Heat Sink | conga-SA5/CSP-B | Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. |
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